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GW1NZ Family Ultra Low Power

GW1NZ Family Ultra Low Power

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Manufacturer: GOWIN

Datasheet: GW1NZ

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Delivers to Europe.

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Product Detail

Ultra low power consumption

  • 55nm embedded flash technology
  • LV: Supports 1.2V core voltage
  • ZV: Supports 0.9V core voltage (below 10uW standby power consumption with Power Management)
  • Power Management Module
  • Clock dynamically turns on and off

Power Management Module

  • SPMI: System power management interface hard core

User Flash

  • 64K bits Data Width: 32
  • 10,000 write cycles
  • Greater than ten years' data retention at +85 ℃
  • Supports page erasure: 2048 bytes per page
  • Duration: Max. 25ns
  • Electric current
    • Read Operation: 2.19 mA/25 ns (VCC) & 0.5 mA/25 ns (VCCX) (MAX);
    • Write operation/erase operation: 12/12 mA(MAX)
  • Quick page erasure/Write operation
  • Clock frequency: 40MHz
  • Write operation time: ≤16μs
  • Page erasure time: ≤120 ms

Multiple I/O Standards

  • LVCMOS33/25/18/15/12;LVTTL33,PCI,
  • Input hysteresis option
  • Supports 4mA,8mA,16mA,24mA,etc. drive options
  • Slew Rate option
  • Output drive strength option
  • Individual Bus Keeper, Weak Pull-up, Weak Pull-down, and Open Drain option
  • Hot Socket
  • I3C hard core, supports SDR mode

Abundant Slices

  • Four input LUT (LUT4)
  • Double-edge flip-flops
  • Supports shifter register
  • Supports shadow SRAM

Block SRAM with multiple modes

  • Supports Dual Port, Single Port, and Semi Dual Port
  • Supports bytes write enable

Flexible PLLs

  • -Frequency adjustment (multiply and division) and phase adjustment
  • Supports global clock

Built-in Flash programming

  • Instant-on Supports security bit operation
  • Supports AUTO BOOT and DUAL BOOT


  • JTAG configuration Offers up to six GowinCONFIG configuration modes: AUTOBOOT, SSPI, MSPI, CPU, SERIAL, DUAL BOOT
Package Pitch (mm) Size (mm) GW1NZ-1
QN32 0.4 4 x 4 25
CS16 0.4 1.8 x 1.8 11

GW1NZ Family Ultra Low Power
The GW1NZ series of FPGA products offer ultra-low power consumption, instant on, extreme low cost, non-volatile, high security, various packages, and flexible usage. They can be widely used in communication, industry control, consumer (especially mobile and wearable), etc.

Pricing Table

Technical Specification

Flip-Flop (FF):
Shadow SRAM S-SRAM(bits):
Block SRAM B-SRAM(bits):
PLLs + DLLs:
1 + 0
User Flash (bits):
1.2V(LV) / 0.9V(ZV)




Founded in 2014, GOWIN Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation world wide with our programmable solutions. GOWIN focus on optimizing our products and removing barriers for customers using programmable logic devices. Their commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Their offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

Learn about GOWIN

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