PM5450-HyPHY-20GFlex
Microchip
PM5450-HyPHY-20GFlex

PM5450-HyPHY-20GFlex

Manufacturer: Microchip

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Delivers to Europe.

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Product Detail

"The PM5450 HyPHY-20GFlex device represents Microsemi's 2nd generation of OTN-enabled, high-capacity system-on-a-chip solutions for Optical Transport Platforms (OTPs), Packet-OTPs, Metro Access Platforms, Wavelength Division Multiplexing (WDM) Platforms, Reconfigurable Optical Add-Drop Multiplexers (ROADMs), and Multi-Service Provisioning Platforms (MSPPs). The HyPHY-20GFlex brings ODU0 and ODUflex capabilities to universal multi-rate, multiservice line, transponder, and muxponder cards.The HyPHY-20GFlex is pin-compatible to the PM5420 HyPHY-20G and delivers unprecedented single-chip scalability and feature integration to enable optimal footprint, power, and cost efficiency. The HyPHY-20GFlex provides a rich set of framing, mapping and multiplexing resources for a variety of protocols, including OTN, SONET/SDH, Ethernet, Fibre Channel, ESCON, FICON, and multi-rate bit transparent services such as video."

PM5450-HyPHY-20GFlex
https://www.epsglobal.com/app_themes/continuum/dist/images/unavailable.jpg?maxsidesize=400
"The PM5450 HyPHY-20GFlex device represents Microsemi's 2nd generation of OTN-enabled, high-capacity system-on-a-chip solutions for Optical Transport Platforms (OTPs), Packet-OTPs, Metro Access Platforms, Wavelength Division Multiplexing (WDM) Platforms, Reconfigurable Optical Add-Drop Multiplexers (ROADMs), and Multi-Service Provisioning Platforms (MSPPs)."
PM5450-HyPHY-20GFlex
New
PM5450-HyPHY-20GFlex
0.00
Microchip
https://www.epsglobal.com/getmetafile/08eb4c8a-e70e-4479-bb89-9c506bf41808

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Technical Specification

Manufacturer

Microchip

Microchip Technology Inc. develops and manufactures semiconductor products for various embedded control applications worldwide. Its portfolio comprises 8- and 16-bit pic microcontrollers and 16-bit dspic digital signal controllers, which feature onboard flash (reprogrammable) memory technology; and linear, mixed-signal, power management, thermal management, battery management, and interface devices.

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